Speeze Spire 5E34B3 Cu-Baseplate Heatsink Desktop CPU Cooler ISO 9002 Certified

Description

Product Description
The Spire 5E32B3 is an all-aluminium cooler (Cu Baseplate) designed for Intel processors based on the Socket 370 design, and AMD processors designed for Socket A and 462 applications. The unit is designed to provide quiet performance even at higher processor speeds. Heatsink dimensions: 70x65x48 mm. Fan dimensions: 60x60x15 mm. Bearing: Ball bearing. Rated speed: 4000 RPM +/-10%. Rated power: 2.04 W. Noise level: 29 dBA. Air flow: 17.1 CFM @ 4000 RPM. Current: 0.17 Amps. Thermal resistance 0.36 °C/W. Thermal type: T725.
Product Features
ISO 9002 Certified
AMD Recommended
Specifically designed Patented Metal Clip
No risk of damage to other components
Easy Installation and Release
Spire 5E34B3 Perspectives
The Fan:
The wire fan grill may be more for show than for real safety, but we can't complain. The fan is moderately noisy, but no where near that of the powerful Delta fans which seem to be popping up on just about every cooler these days. Interestingly, the fan used on the 5E34B3 is only 15mm in height. Many current solutions seem to be opting for the 25mm height fans for their added CFM ratings. The fan comes with RPM monitor and hooks into the onboard fan headers via a three-pin connector.
Heatsink Top:
Without the fan on top of the heatsink it is easier to see the cuts made for the clip. The heatsink is a little longer than it normally might be and the cuts help allow the clip to easily lock into place. The clip is made such that it can only fit into the heatsink in one direction. Additionally the small tabs stop the heatsink from sliding when the motherboard is in a vertical position.
Side A:
Side channels 2mm in width are cut out in six positions to help air flow through the fins in an effective manner. While the outer fins are serrated, the inner fins are without the feature
. Typically older fin designs employed the serrated surface finish to help induce turbulence. As the fins on this heatsink are only ~1mm thick it may not be possible to add this treatment.
Side B:
Those tall and skinny fins look quite good for cooling from this angle, but the question remains; is the heat moving from the copper potion with ease? The clip sits in a little channel so that the length of the heatsink is actually a little longer then it would normally be. The aluminum base is just over 3mm thick, the copper 4mm.
Heatsink Base:
Behind the blue protective cover is some pink, bubble-gum like thermal phase change material. It is a bit sticky, but when heat is applied to it is starts to flow and allows for a very tight thermal joint. Personally we prefer to use silver based thermal compound however. The surface finish of the central region of the copper is good in terms of flatness, but still shows marks from the manufacturers brushing or sanding operation.